Semi-Automatic Wafer Grinder

The object of the tender is a Semi-Automatic Wafer Grinder with manual wafer loading and unloading on the chuck table (later also “Equipment”), capable of thinning Si, SiC, LiNbO3 and other typical semi-conducting wafers of 200 and 300 mm diameter to varying thicknesses with end-point control, TTV profile control, capability …

CPV: 42900000 Diverse machines voor algemeen en specifiek gebruik
Deadline:
17 november 2025 07:00
Soort termijn:
Indiening van een bod
Plaats van uitvoering:
Semi-Automatic Wafer Grinder
Toekennende instantie:
VTT Technical Research Centre of Finland Ltd
Gunningsnummer:
Reg.no. 63/206/2025

1. Buyer

1.1 Buyer

Official name : VTT Technical Research Centre of Finland Ltd
Legal type of the buyer : Public undertaking
Activity of the contracting authority : Economic affairs

2. Procedure

2.1 Procedure

Title : Semi-Automatic Wafer Grinder
Description : The object of the tender is a Semi-Automatic Wafer Grinder with manual wafer loading and unloading on the chuck table (later also “Equipment”), capable of thinning Si, SiC, LiNbO3 and other typical semi-conducting wafers of 200 and 300 mm diameter to varying thicknesses with end-point control, TTV profile control, capability to thin wafers down to 10um thickness with supporting tape and capability to grind only a determined distance from edge-to-center. Equipment must be new. The tool must comply with cleanroom equipment standard safety and contamination requirements. The object of the tender process is described in more detail in the invitation to tender documents.
Procedure identifier : dde3f9e2-2ac9-4d69-a9f6-951468ab0463
Internal identifier : Reg.no. 63/206/2025
Type of procedure : Open
The procedure is accelerated : no
Main features of the procedure : The tender process is based on the open procedure applicable to contracts that exceed the EU procurement threshold.

2.1.1 Purpose

Main nature of the contract : Supplies
Main classification ( cpv ): 42900000 Miscellaneous general and special-purpose machinery

2.1.2 Place of performance

Postal address : Tekniikantie 17
Town : Esp
Postcode : 02600
Country subdivision (NUTS) : Helsinki-Uusimaa ( FI1B1 )
Country : Finland
Additional information : Please see the invitation to tender.

2.1.4 General information

Additional information : The object of the tender process is described in more detail in the invitation to tender documents.
Legal basis :
Directive 2014/24/EU

2.1.6 Grounds for exclusion

Sources of grounds for exclusion : European Single Procurement Document (ESPD), Procurement Document

5. Lot

5.1 Lot technical ID : LOT-0000

Title : Semi-Automatic Wafer Grinder
Description : The object of the tender is a Semi-Automatic Wafer Grinder with manual wafer loading and unloading on the chuck table (later also “Equipment”), capable of thinning Si, SiC, LiNbO3 and other typical semi-conducting wafers of 200 and 300 mm diameter to varying thicknesses with end-point control, TTV profile control, capability to thin wafers down to 10um thickness with supporting tape and capability to grind only a determined distance from edge-to-center. Equipment must be new. The tool must comply with cleanroom equipment standard safety and contamination requirements. The object of the tender process is described in more detail in the invitation to tender documents.
Internal identifier : Reg.no. 63/206/2025

5.1.1 Purpose

Main nature of the contract : Supplies
Main classification ( cpv ): 42900000 Miscellaneous general and special-purpose machinery

5.1.2 Place of performance

Postal address : Tekniikantie 17
Town : Esp
Postcode : 02600
Country subdivision (NUTS) : Helsinki-Uusimaa ( FI1B1 )
Country : Finland
Additional information : Please see the invitation to tender.

5.1.3 Estimated duration

Duration : 24 Month

5.1.6 General information

Reserved participation : Participation is not reserved.
Procurement Project not financed with EU Funds.
The procurement is covered by the Government Procurement Agreement (GPA) : yes
This procurement is also suitable for small and medium-sized enterprises (SMEs) : yes
Additional information : The object of the tender process is described in more detail in the invitation to tender documents.

5.1.7 Strategic procurement

Social objective promoted : Human rights due diligence in global supply chains

5.1.9 Selection criteria

Sources of selection criteria : Procurement Document

5.1.10 Award criteria

Criterion :
Type : Price
Description : The evaluation of the tenders is described in section 'Grounds for decision'.
Category of award threshold criterion : Weight (percentage, exact)
Award criterion number : 100

5.1.11 Procurement documents

Languages in which the procurement documents are officially available : English
Deadline for requesting additional information : 31/10/2025 07:00 +00:00

5.1.12 Terms of procurement

Terms of submission :
Electronic submission : Required
Languages in which tenders or requests to participate may be submitted : English
Electronic catalogue : Not allowed
Variants : Not allowed
Tenderers may submit more than one tender : Not allowed
Deadline for receipt of tenders : 17/11/2025 07:00 +00:00
Deadline until which the tender must remain valid : 6 Month
Information about public opening :
Opening date : 17/11/2025 07:05 +00:00
Place : Tampere Tarjousten avaamisen ajankohta on alustava. Tarjousten avaustilaisuus ei ole julkinen.
Terms of contract :
The execution of the contract must be performed within the framework of sheltered employment programmes : No
Conditions relating to the performance of the contract : A binding contract between the parties concerning the subject of the procurement shall not enter into force until both parties have signed the contract. For more information, please see the invitation to tender.
Electronic invoicing : Required
Electronic ordering will be used : no
Electronic payment will be used : yes

5.1.15 Techniques

Framework agreement :
No framework agreement
Information about the dynamic purchasing system :
No dynamic purchase system

5.1.16 Further information, mediation and review

Review organisation : Markkinaoikeus
Information about review deadlines : Muutoksenhakuaika määräytyy hankintalain (1397/2016) mukaisesti.
Organisation providing additional information about the procurement procedure : VTT Technical Research Centre of Finland Ltd
Organisation receiving requests to participate : VTT Technical Research Centre of Finland Ltd
Organisation processing tenders : VTT Technical Research Centre of Finland Ltd

8. Organisations

8.1 ORG-0001

Official name : Markkinaoikeus
Registration number : 3006157-6
Postal address : Radanrakentajantie 5
Town : Helsinki
Postcode : 00520
Country subdivision (NUTS) : Helsinki-Uusimaa ( FI1B1 )
Country : Finland
Telephone : +358 295643300
Roles of this organisation :
Review organisation

8.1 ORG-0002

Official name : VTT Technical Research Centre of Finland Ltd
Registration number : 2647375-4
Postal address : P.O. Box 1000, VTT
Town : Espoo
Postcode : 02044
Country subdivision (NUTS) : Helsinki-Uusimaa ( FI1B1 )
Country : Finland
Contact point : VTT Technical Research Centre of Finland Ltd
Telephone : +358 20722111
Roles of this organisation :
Buyer
Organisation providing additional information about the procurement procedure
Organisation receiving requests to participate
Organisation processing tenders

8.1 ORG-0003

Official name : Hansel Oy (Hilma)
Registration number : FI09880841
Postal address : Mannerheiminaukio 1a
Town : Helsinki
Postcode : 00100
Country subdivision (NUTS) : Helsinki-Uusimaa ( FI1B1 )
Country : Finland
Contact point : eSender
Telephone : 029 55 636 30
Roles of this organisation :
TED eSender

Notice information

Notice identifier/version : 6aacabe8-61fa-47fd-a3ce-0f2053b22080 - 01
Form type : Competition
Notice type : Contract or concession notice – standard regime
Notice dispatch date : 17/10/2025 12:14 +00:00
Notice dispatch date (eSender) : 17/10/2025 12:14 +00:00
Languages in which this notice is officially available : English
Notice publication number : 00689551-2025
OJ S issue number : 201/2025
Publication date : 20/10/2025