Supply, Delivery and Commissioning of a High-Precision Wafer Lapping and Polishing System for Tyndall National Institute, UCC

Tenders are sought for the supply and delivery of High-Precision Wafer Lapping and Polishing System for Tyndall National Institute, UCC. Miniaturisation and integration are key themes across all areas of Tyndall’s research. Development of next generation technologies requires ever decreasing device sizes coupled with ever-increasing functionality. The task of miniaturisation …

CPV: 38000000 Laboratory, optical and precision equipments (excl. glasses), 38400000 Instruments for checking physical characteristics, 38500000 Checking and testing apparatus, 38900000 Miscellaneous evaluation or testing instruments, 38800000 Industrial process control equipment and remote-control equipment, 38300000 Measuring instruments, 38600000 Optical instruments
Deadline:
June 25, 2024, 2 p.m.
Deadline type:
Submitting a bid
Place of execution:
Supply, Delivery and Commissioning of a High-Precision Wafer Lapping and Polishing System for Tyndall National Institute, UCC
Awarding body:
University College Cork
Award number:
UCC-2024-09

1. Buyer

1.1 Buyer

Official name : University College Cork
Legal type of the buyer : Body governed by public law
Activity of the contracting authority : Education

2. Procedure

2.1 Procedure

Title : Supply, Delivery and Commissioning of a High-Precision Wafer Lapping and Polishing System for Tyndall National Institute, UCC
Description : Tenders are sought for the supply and delivery of High-Precision Wafer Lapping and Polishing System for Tyndall National Institute, UCC. Miniaturisation and integration are key themes across all areas of Tyndall’s research. Development of next generation technologies requires ever decreasing device sizes coupled with ever-increasing functionality. The task of miniaturisation beings with device design and fabrication where sub-micron technologies are now industry standard, and the development of nanoscale processes is progressing rapidly. The challenges of miniaturisation extend onwards to the back-end processes where the removal of unused bulk semiconductor material through precision lapping and polishing is essential to minimising the size of a final device. Tyndall now wishes to enhance its back-end processing capability through the procurement of a high-precision wafer lapping and polishing system for use with silicon, III-V and other semiconductor materials.
Procedure identifier : 09213d57-e477-4a8d-b302-8bf7564906af
Type of procedure : Open
The procedure is accelerated : no

2.1.1 Purpose

Main nature of the contract : Supplies
Main classification ( cpv ): 38000000 Laboratory, optical and precision equipments (excl. glasses)
Additional classification ( cpv ): 38400000 Instruments for checking physical characteristics
Additional classification ( cpv ): 38500000 Checking and testing apparatus
Additional classification ( cpv ): 38900000 Miscellaneous evaluation or testing instruments
Additional classification ( cpv ): 38800000 Industrial process control equipment and remote-control equipment
Additional classification ( cpv ): 38300000 Measuring instruments
Additional classification ( cpv ): 38600000 Optical instruments

2.1.3 Value

Estimated value excluding VAT : 81 000 Euro
Maximum value of the framework agreement : 81 000 Euro

2.1.4 General information

Legal basis :
Directive 2014/24/EU

2.1.5 Terms of procurement

Terms of submission :
Maximum number of lots for which one tenderer can submit tenders : 0

2.1.6 Grounds for exclusion

Purely national exclusion grounds :

5. Lot

5.1 Lot technical ID : LOT-0001

Title : Supply, Delivery and Commissioning of a High-Precision Wafer Lapping and Polishing System for Tyndall National Institute, UCC
Description : Tenders are sought for the supply and delivery of High-Precision Wafer Lapping and Polishing System for Tyndall National Institute, UCC. Miniaturisation and integration are key themes across all areas of Tyndall’s research. Development of next generation technologies requires ever decreasing device sizes coupled with ever-increasing functionality. The task of miniaturisation beings with device design and fabrication where sub-micron technologies are now industry standard, and the development of nanoscale processes is progressing rapidly. The challenges of miniaturisation extend onwards to the back-end processes where the removal of unused bulk semiconductor material through precision lapping and polishing is essential to minimising the size of a final device. Tyndall now wishes to enhance its back-end processing capability through the procurement of a high-precision wafer lapping and polishing system for use with silicon, III-V and other semiconductor materials.
Internal identifier : UCC-2024-09

5.1.1 Purpose

Main nature of the contract : Supplies
Main classification ( cpv ): 38000000 Laboratory, optical and precision equipments (excl. glasses)
Additional classification ( cpv ): 38400000 Instruments for checking physical characteristics
Additional classification ( cpv ): 38500000 Checking and testing apparatus
Additional classification ( cpv ): 38900000 Miscellaneous evaluation or testing instruments
Additional classification ( cpv ): 38800000 Industrial process control equipment and remote-control equipment
Additional classification ( cpv ): 38300000 Measuring instruments
Additional classification ( cpv ): 38600000 Optical instruments

5.1.5 Value

Estimated value excluding VAT : 81 000 Euro
Maximum value of the framework agreement : 81 000 Euro

5.1.6 General information

Reserved participation : Participation is not reserved.
Procurement Project not financed with EU Funds.
The procurement is covered by the Government Procurement Agreement (GPA) : yes

5.1.7 Strategic procurement

5.1.9 Selection criteria

Criterion :
Type : Other

5.1.11 Procurement documents

Languages in which the procurement documents are officially available : English
Languages in which the procurement documents (or their parts) are unofficially available : English

5.1.12 Terms of procurement

Terms of submission :
Electronic submission : Required
Languages in which tenders or requests to participate may be submitted : English
Electronic catalogue : Not allowed
Tenderers may submit more than one tender : Not allowed
Deadline for receipt of tenders : 25/06/2024 14:00 +01:00
Information about public opening :
Opening date : 25/06/2024 14:30 +01:00
Terms of contract :
The execution of the contract must be performed within the framework of sheltered employment programmes : Not yet known
Electronic invoicing : Required
Electronic ordering will be used : yes
Electronic payment will be used : yes

5.1.15 Techniques

Framework agreement :
No framework agreement
Information about the dynamic purchasing system :
No dynamic purchase system
Electronic auction : no

5.1.16 Further information, mediation and review

Review organisation : The High Court of Ireland
Organisation providing offline access to the procurement documents : University College Cork
Organisation receiving requests to participate : University College Cork
Organisation processing tenders : University College Cork
TED eSender : European Dynamics S.A.

8. Organisations

8.1 ORG-0001

Official name : University College Cork
Registration number : IE0006286E
Postal address : University College Cork, 6 Elderwood, College Road
Town : Cork
Postcode : T12 VH39
Country : Ireland
Telephone : +353 21 4903514
Internet address : https://www.ucc.ie
Buyer profile : https://www.ucc.ie
Roles of this organisation :
Buyer
Organisation providing offline access to the procurement documents
Organisation receiving requests to participate
Organisation processing tenders

8.1 ORG-0002

Official name : The High Court of Ireland
Registration number : The High Court of Ireland
Department : The High Court of Ireland
Postal address : Four Courts, Inns Quay, Dublin 7
Town : Dublin
Postcode : D07 WDX8
Country : Ireland
Telephone : +353 1 8886000
Roles of this organisation :
Review organisation

8.1 ORG-0003

Official name : European Dynamics S.A.
Registration number : 002024901000
Department : European Dynamics S.A.
Town : Athens
Country : Greece
Telephone : +30 2108094500
Roles of this organisation :
TED eSender

11. Notice information

11.1 Notice information

Notice identifier/version : 4d0e7264-261a-4899-8ddd-2dcb3e86c0ba - 01
Form type : Competition
Notice type : Contract or concession notice – standard regime
Notice dispatch date : 22/05/2024 16:41 +01:00
Languages in which this notice is officially available : English

11.2 Publication information

Notice publication number : 00307081-2024
OJ S issue number : 100/2024
Publication date : 24/05/2024