Cluster ALE/ICP/RIE + PECVD + ALD (HHI-07) The required cluster tool should include a loadlock and a handler, three separate process chambers for ALE/ICP/RIE (Atomic Layer Etching/Inductively Coupled Plasma/Reactive Ion Etching), ALD (Atomic Layer Deposition), and ICP-PECVD (Inductively Coupled Plasma-Plasma Enhanced Chemical Vapor Deposition). After etching the InP, In(Al)GaAsP, and …

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